Solder interconnection verification

Details Solder interconnection verification Solder interconnection verification

1990-11-29

1993-02-09

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228105, H05K 334

Patent

active

051847680

ABSTRACT:
A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.

REFERENCES:
patent: 4457467 (1984-07-01), Klement et al.
patent: 4941256 (1990-07-01), Capson et al.
patent: 4944447 (1990-07-01), Thome
patent: 5012502 (1991-04-01), Battin et al.

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