Solder interconnection structure on organic substrates and proce

Details Solder interconnection structure on organic substrates and proce Solder interconnection structure on organic substrates and proce

1992-06-01

1994-03-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437212, 437213, H01L 2120

Patent

active

052926885

ABSTRACT:
Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.

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