Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1990-03-14
1992-06-09
Hille, Rolf
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 65, 357 67, 361401, 361402, 2281801, 2281802, H01L 2314, H01L 2354, H01L 2340
Patent
active
051211904
ABSTRACT:
Solder interconnection whereby the gap created by solder connections between an organic substrate and semiconductor device is filled with a composition obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns.
REFERENCES:
patent: 3429040 (1969-02-01), Miller
patent: 3949125 (1976-04-01), Roberts
patent: 4504283 (1985-03-01), Charvat
patent: 4579806 (1986-04-01), Schupp et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4864471 (1989-09-01), Hargasser et al.
patent: 4999699 (1991-03-01), Christie et al.
Chemical Abstracts, 164236A, vol. 82, 1975.
Hsiao Richard
Markovich Voya R.
McCreary Jack M.
Seraphim Donald P.
Clark S. V.
Hille Rolf
International Business Machines Corp.
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