Solder interconnection structure and process for making

Details Solder interconnection structure and process for making Solder interconnection structure and process for making

1996-07-12

1997-09-16

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438124, 438119, 438612, H01L 2160

Patent

active

056680597

ABSTRACT:
Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

REFERENCES:
patent: 3949125 (1976-04-01), Roberts
patent: 4504283 (1985-03-01), Charvat
patent: 4579806 (1986-04-01), Schupp et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4999699 (1991-03-01), Christie et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5250848 (1993-10-01), Christie et al.

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