Solder glass composition and method of using same for encapsulat

Details Solder glass composition and method of using same for encapsulat Solder glass composition and method of using same for encapsulat

1973-10-26

1976-06-22

Douglas, Winston A.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 47R, C03C 304, C03C 310

Patent

active

039649202

ABSTRACT:
A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO.sub.2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF.sub.2 about 2-10 percent, CdO about 1-5 percent, TiO.sub.2 about 0.5-3 percent and B.sub.2 O.sub.3 about 10-14 percent.

REFERENCES:
patent: 3055762 (1962-09-01), Hoffman
patent: 3258350 (1966-06-01), Martin et al.
patent: 3421916 (1969-01-01), Nukoda et al.
patent: 3723835 (1973-03-01), Davis et al.
patent: 3813295 (1974-05-01), Mason et al.

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