Solder-free packaging for integrated fiber optics device

Details Solder-free packaging for integrated fiber optics device Solder-free packaging for integrated fiber optics device

2007-05-29

2007-05-29

Kim, Ellen E. (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

Reexamination Certificate

active

11127951

ABSTRACT:
Techniques for packaging in an optical device and an opto-electrical conversion device are disclosed. According to one aspect of the techniques, the optical device is packaged in a piece of tubing and the opto-electrical conversion device is packaged in a TO-can. While the optical device and the opto-electrical conversion device are coaxially aligned, the tube and the TO-can are integrated by a certain amount of epoxy that is later cured by a UV light or heat. As a result, an integrated optical device is formed and enjoys features of small footprint, better alignment, enhanced impact performance, lower cost in addition to easier manufacturing process and environmental-safe.

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