Solder for use on surfaces coated with nickel by electroless...

Details Solder for use on surfaces coated with nickel by electroless... Solder for use on surfaces coated with nickel by electroless...

2006-11-07

2006-11-07

Ip, Sikyin (Department: 1742)

Metal treatment

Stock

C420S559000, C420S562000

Reexamination Certificate

active

07132020

ABSTRACT:
A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.

REFERENCES:
patent: 6033488 (2000-03-01), An et al.
patent: 6307160 (2001-10-01), Mei et al.
patent: 0652072 (1995-05-01), None
patent: 11000791 (1999-01-01), None
patent: 11267880 (1999-10-01), None
Shi-Wei Ricky Lee et al, “Assessment on the Effects of Electronless Nickel Plating on the Reliability of Solder Ball Attachment to the Bond Pads of PBGA Substrate”, 2000 Proceedings, 50th Electronic Components and Technology Conference, ECTC 2000, Las Vegas, May 21-24, 2000. Proceedings of the Electronic Components and Technology Conference, New York; IEEE US, vol. Conf. 50, May 21, 2000 pp. 868-873.
Zequn Mei et al, “Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Nickel/Immersion Gold”, Electronic Components & Technology Conference, 1998, 48th IEEE Seattle, Wa. May 25-28, 1998, New York, IEEE, US May 25, 1998, pp. 952-961.
Patent abstracts of Japan, vol. 1999, No. 04, Apr. 30, 1999, Abstract of JP 11-00791 A, published on Jan. 6, 1999.
Patent Abstracts of Japan, vol. 1995, No. 11, Dec. 26, 1995, Abstract of JP 07-195189 A, published on Aug. 1,1995.
Patent Abstracts of Japan, vol. 2000, No. 13, Feb. 5, 2001, Abstract of JP 2000-277895 A, published on Oct. 6, 2000.

Affiliated with

Also associated with

Rating

Solder for use on surfaces coated with nickel by electroless... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder for use on surfaces coated with nickel by electroless..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder for use on surfaces coated with nickel by electroless... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3625941