Solder fluxing method and apparatus

Details Solder fluxing method and apparatus Solder fluxing method and apparatus

1986-02-19

1987-08-04

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

228 31, 228 37, 228207, 118 74, 427310, H05K 322

Patent

active

046845445

ABSTRACT:
Solder flux is applied to the face of a printed circuit board (24) or the like by flowing a foam (30) of liquid flux bubbles upwardly through the top of a chimney flue (10) and into contact with the board face which is top passed over the top of the flue. The size of bubbles adjacent the face of the board is controlled by placing a grid screen (26) within and immediately beneath the top of the flue. The openings (26a) in the grid screen allow passage therethrough of smaller bubbles (34) but prevent passage of larger bubbles (32). The force of the board face on the foam urges the larger bubbles downwardly into contact with the grid screen where the grid wires of the screen pierce and thereby break the larger bubbles into smaller bubbles which then rise to the face of the board.

REFERENCES:
patent: 3135630 (1964-06-01), Bielinski
patent: 3216643 (1965-11-01), De Vorter
patent: 3218193 (1965-11-01), Isaacson
patent: 3589590 (1971-06-01), Fitzsimmons
patent: 4009816 (1977-03-01), Feuchtbaum
patent: 4158076 (1979-06-01), Wallsten
patent: 4162034 (1979-07-01), Paulas

Affiliated with

Also associated with

Rating

Solder fluxing method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder fluxing method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder fluxing method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-883278