Metal fusion bonding – Including means to apply flux or filler to work or applicator – By brush – wick – or pad
Patent
1990-10-09
1991-12-24
Seidel, Richard K.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By brush, wick, or pad
228207, 228223, 228 33, 401198, 401 27, B23K 100
Patent
active
050744550
ABSTRACT:
A dispenser (100) for solder flux includes a first solder flux reservoir (110) with a dispensing tip (118) at one end thereof for dispensing solder flux (112) in response to a frictional pressure applied to the tip. A second solder flux reservoir (102) is also included having a dispensing channel (106) for dispensing solder flux (104) responsive to a pressure applied to the flux (104) within the second solder flux reservoir (102).
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Peana Stefan
Pine Jerrold S.
Berry Thomas G.
Elpel Jeanne M.
Ingrassia Vincent B.
Motorola Inc.
Seidel Richard K.
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