Solder flow well for reflowing solder of multipin components

Metal fusion bonding – Specialized pot

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Details

228 19, 228 20, 228 39, 228191, 228264, B23K 300

Patent

active

049429973

ABSTRACT:
A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed within or adjacent the through hole pattern.

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