Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1992-02-13
1993-09-28
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
118421, 118423, 118425, C23C 2600
Patent
active
052485200
ABSTRACT:
Apparatus (10) and method for solder finishing the leads of an integrated circuit package are applicable to "flat packs" or flat packages having coplanar rows of leads (84) along sides of the flat package (75). First and second tracks (22,26) are formed with elongate first and second supporting surfaces (72,74) oriented with the first and second supporting surfaces at opposite first and second downwardly depending angles (.THETA.1,.THETA.2). First and second index edges (70) are formed along the respective first and second supporting surfaces of the first and second tracks (22,26) for retaining a flat package (75) at the respective opposite first and second downwardly depending angles. Vertical first and second falling columns of molten solder are established at first and second loci of solder finishing (16a,16b) defined by solder bridge sections (66,68) with the first and second falling columns (85) located on the lower sides of the respective first and second tracks (22,26). A conveyor line (44) formed with pushers (76) pushes the flat package on the respective first and second tracks (22,26) along first and second transport paths (25,28) with respective downwardly depending first and second rows of leads (84) passing through the respective first and second tilting mechanism (100) at the transfer end of the track section lifts the flat package from the first track (22), reorients the flat package from the first downwardly depending angle (.THETA.1) to the second downwardly depending angle (.THETA.2) and deposits the flat package (75) on the second track (26).
REFERENCES:
patent: 2770875 (1956-11-01), Zimmerman
patent: 4682563 (1987-07-01), Masuda
patent: 4720396 (1988-01-01), Wood
Doherty Roger H.
Wood Richard C.
Beck Shrive
Calderwood Richard C.
Dang Vi Duong
Kane Daniel H.
National Semiconductor Corporation
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