Solder feeding system

Details Solder feeding system Solder feeding system

1985-06-14

1988-04-12

Recla, Henry J.

Fluent material handling, with receiver or receiver coacting mea

With material treatment

Heating or cooling

141 95, 141 98, 414160, 414189, 222 56, 221 12, 221301, B65B 5700

Patent

active

047367806

ABSTRACT:
A solder feeding system including an apparatus for supplying a predetermined number of solder balls to at least one soldering bath once the level of liquid solder in the bath drops below a defined limit. The solder ball is shaped to have a diameter of from 5 mm to 50 mm, preferably 10 mm to 30 mm by casting, forging, or rolling. The number of solder balls added have a volume capable of raising the level of liquid solder in the bath by a distance similar to or less than a range of tolerable upper and lower limits and a thermal capacity to lower the temperature of the liquid solder within a tolerable range.

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patent: 3938654 (1976-02-01), Mohr
patent: 4405059 (1983-09-01), Kull

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