Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1990-04-20
1992-06-16
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228198, H01L 2150, B23K 119
Patent
active
051218712
ABSTRACT:
Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.
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Beavis Leonard C.
Karnowsky Maurice M.
Yost Frederick G.
Chafin James H.
Daniel Anne D.
Heinrich Samuel M.
Moser William R.
The United States of America as represented by the United States
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