Solder electroplating solution containing gelatin

Details Solder electroplating solution containing gelatin Solder electroplating solution containing gelatin

1994-09-09

1996-10-01

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C25D 360

Patent

active

055608132

ABSTRACT:
The present invention relates to a fluoroborate solder electroplating solution containing lead (Pb) and tin (Sn) ions, in which the total Pb and Sn ion content is 35.5 to 150 g/l, and 70 wt % of them is Sn. The fluoroborate solder electroplating solution further contains 0.05-5 g gelatin per liter of the solder electroplating solution as an additive for increasing the deposition of Sn ions and enhancing the microstructural fineness of the solder plating. A suitable current density is 1 to 3 A/dm.sup.2 in electroplating the present solder electroplating solution.

REFERENCES:
patent: 3785939 (1974-01-01), Hsu
patent: 4270986 (1981-06-01), Smith

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