Solder deposition system

Details Solder deposition system Solder deposition system

1989-09-14

1990-06-19

Hoag, Willard

Coating apparatus

With vacuum or fluid pressure chamber

118 58, 118 74, 118410, B05C 102

Patent

active

049343092

ABSTRACT:
A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an ominidirectional tool for deposition.

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Above References Cited in Ser. No. 181,775 Prosecution and Cited by Applicant by "FAX" filed 11-21-89, 11-22-89.
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