Solder deposition system

Details Solder deposition system Solder deposition system

1988-04-15

1990-02-06

Hoag, Willard

Coating apparatus

Control means responsive to a randomly occurring sensed...

Condition of coated material

118679, 118690, 118 74, 118600, 118413, B05C 102

Patent

active

048981176

ABSTRACT:
A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.

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