Solder deposition method

Details Solder deposition method Solder deposition method

2005-08-16

2005-08-16

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S170000, C228S179100

Reexamination Certificate

active

06929170

ABSTRACT:
A solder deposition method according to the present invention comprises the steps of: (1) providing a solder slab; (2) providing a complementary means having a plurality of through holes; (3) providing a circuit element, which is composed of an insulating body and a plurality of embedded conducting terminals; (4) placing the circuit element under the complementary means and the solder slab above the complementary means, and injecting a plurality of solder bits taken from the solder slab by a punching device through the complementary means into the solder-retaining units of the conducting terminals. This method is advantageous in the simplicity of soldering instrumentation and process, which significantly reduces production costs.

REFERENCES:
patent: 5184767 (1993-02-01), Estes
patent: 5735452 (1998-04-01), Yu et al.
patent: 5954262 (1999-09-01), Inoue et al.
patent: 6249963 (2001-06-01), Chou et al.
patent: 6279814 (2001-08-01), Inoue et al.
patent: 2003/0193094 (2003-10-01), Takahashi et al.
patent: 2004/0135251 (2004-07-01), Tellkamp et al.
patent: 405291260 (1993-11-01), None
patent: 06045740 (1994-02-01), None
patent: 09326552 (1997-12-01), None
patent: 410125684 (1998-05-01), None

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