Solder delivery systems

Details Solder delivery systems Solder delivery systems

1986-03-17

1987-12-15

Godici, Nicholas P.

Metal fusion bonding

Solder form

2281802, 228225, 228245, 439 83, H01L 2158, B23K 112

Patent

active

047127210

ABSTRACT:
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.

REFERENCES:
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3396894 (1965-05-01), Ellis
patent: 3472365 (1969-10-01), Tiedema
patent: 3516155 (1970-06-01), Smith
patent: 3719981 (1973-03-01), Steitz
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 3795884 (1974-03-01), Kotaka
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 3991463 (1976-11-01), Squitieri et al.
patent: 3998512 (1976-12-01), Anhalt et al.
patent: 4027936 (1977-06-01), Nemoto et al.
patent: 4064623 (1977-12-01), Moore
patent: 4067104 (1978-01-01), Tracy
patent: 4089575 (1978-05-01), Grabbe
patent: 4144648 (1979-03-01), Grovender
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4216350 (1980-08-01), Reid
patent: 4295700 (1981-10-01), Sado
patent: 4334727 (1982-06-01), Scheingold et al.
patent: 4354629 (1982-10-01), Grassauer et al.
patent: 4390220 (1983-06-01), Benasutti
patent: 4402450 (1983-09-01), Abraham et al.
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4445736 (1984-05-01), Hopkins
patent: 4458968 (1984-07-01), Madden
patent: 4556276 (1985-12-01), Curtis, III
IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, pp. 2322-2324, Druschel et al.

Affiliated with

Also associated with

Rating

Solder delivery systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder delivery systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder delivery systems will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1215035