Solder delivery system

Details Solder delivery system Solder delivery system

1990-03-27

1991-08-20

Heinrich, Samuel M.

Metal fusion bonding

Solder form

228248, B23K 3514, H05K 334

Patent

active

050407171

ABSTRACT:
A solder delivery system including a carrier of compliant, dimensionally passive, high-temperature material, the carrier remaining generally dimensionally passive during heating and having a detent therein including fusible material, preferably in the form of a solder paste, positioned therein which is plastically deformable and adhesive-like, the carrier and fusible material together being compliant to conform to objects to be soldered before heating of the system.

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Computer Design, "Termination System . . . ", vol. 19; No. 11, p. 108, Nov. 1980.
IBM Technical Disclosure Bulletin, "Polyurethane Solder Preforms"; vol. 12, No. 12, p. 2222, May 1970.

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