Metal fusion bonding – Process – With shaping
Patent
1987-07-13
1988-02-02
Godici, Nicholas P.
Metal fusion bonding
Process
With shaping
228179, 228256, 228 563, B23K 306, B23K 3102, B23K 3706
Patent
active
047224711
ABSTRACT:
This invention relates to heat-shrinkable devices for forming solder connections between two bodies such as electrical conductors or pipes. The devices each comprise a hollow, heat-shrinkable sleeve having at least one aperture and containing first and second solder inserts. The solder inserts are located adjacent to each other and the second insert responds to heat applied to the device more slowly than the first insert. Usually the second insert has a higher melting point than the first insert. When the device is installed the first solder insert melts but is prevented from flowing out of the aperture in the device by the second insert. Also flow of the fused first solder insert onto the second solder insert causes the second insert to melt with less heat being applied to the device than would be needed if only the second, higher melting point solder insert were present in the device.
REFERENCES:
patent: 3065539 (1962-11-01), Hannegan
patent: 3243211 (1966-03-01), Wetmore
patent: 3316343 (1967-04-01), Sherlock
patent: 3525799 (1970-08-01), Ellis
patent: 3678174 (1972-07-01), Ganzhorn
patent: 3818123 (1974-06-01), Maltz et al.
patent: 4505421 (1985-03-01), Gen et al.
Raychem Devices Division Europe Coaxial Splice Kit B500.0157, Raychem Devices Division Europe TelPak Splice TSN75TA07/29, and TSN 75 S 07/29; TSN 75 RA 07/29; TSN 75 TA 12/44.
Bostock Peter A.
Gray Roger W.
Roux Christian G.
Burkard Herbert G.
Dillahunty T. Gene
Godici Nicholas P.
Heinrich Samuel M.
Raychem Pontoise S.A.
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