Solder composition for high-density circuits

Details Solder composition for high-density circuits Solder composition for high-density circuits

1984-09-04

1985-04-09

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

B23K 3534

Patent

active

045099944

ABSTRACT:
Novel solder composition or solder cream, particularly adapted for soldering components in high-density electronic circuits, e.g., fusing electrical components to small pads of the order of 10 mils square or smaller, comprising a narrow range of between 10 and 14% flux-containing vehicle and between 86 and 90% of solder metal, and employing solder metal of particle size ranging from about 0.2 to about 35 microns.

REFERENCES:
patent: 3684533 (1972-08-01), Conwicke

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