Solder composition

Details Solder composition Solder composition

1984-10-15

1985-07-30

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 26, B23K 3534

Patent

active

045319863

ABSTRACT:
Novel solder composition or solder cream, particularly adapted for high speed soldering of components in electronic circuits, whereby movement of components is avoided and essentially no solder balls are formed, comprising between 10 and 14% of a vehicle and between 86 and 90% of solder metal dispersed in the vehicle, preferably employing solder metal of particle size ranging from about 40 to about 70 microns, and utilizing as solvent in the vehicle a low volatile high molecular weight alcohol, preferably a primary aliphatic monoalcohol containing about 8 to about 18 carbon atoms, e.g., cetyl alcohol, in an amount of about 10 to about 50% by weight of the vehicle.

REFERENCES:
patent: 2914435 (1959-11-01), Wasserman
patent: 2978370 (1961-04-01), Mulholland
patent: 4373974 (1983-02-01), Barajas

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