Solder composition

Details Solder composition Solder composition

1986-08-21

1987-09-22

Rutledge, L. Dewayne

Alloys or metallic compositions

Tin base

Copper containing

420560, C22C 1900, C22C 1802

Patent

active

046954287

ABSTRACT:
A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.1-3.0% silver, 0.1-2.0% copper and 86.8-98.8% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.

REFERENCES:
patent: 1437641 (1922-12-01), Ferriere et al.
patent: 1869378 (1932-08-01), Konigsberg

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