Solder composition

Details Solder composition Solder composition

1981-04-02

1983-02-15

Rosenberg, P. D.

Metal treatment

Compositions

Fluxing

148 25, B23K 3534

Patent

active

043739741

ABSTRACT:
Novel solder composition or solder cream, particularly adapted for soldering components in electronic circuitry, comprising finely divided solder metals such as tin and lead, dispersed in a vehicle containing viscosity controlling agents, organic solvents, and a rosin or rosin derivative as a flux. By employing a narrow range of rosin-containing vehicle, that is between 13 and 14%, and between 86 and 87% of solder metal, by weight of the solder composition, and fine particle size solder metal of from 40 to 70 microns, the formation of solder balls is essentially eliminated, thus avoiding the necessity of removing such solder balls.

REFERENCES:
patent: 3684533 (1972-08-01), Conwicke
patent: 3762965 (1973-10-01), Amin

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