Solder composition

Details Solder composition Solder composition

1986-02-10

1987-04-21

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 26, B23K 3534

Patent

active

046593993

ABSTRACT:
A solder composition containing a small amount of aluminum added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate aluminum, by weight of the solder metal.

REFERENCES:
patent: 4070192 (1978-01-01), Arbib

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