Solder composition

Details Solder composition Solder composition

1980-12-08

1982-11-02

Roy, Upendra

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75175A, C22C 1400, C22C 1300

Patent

active

043571620

ABSTRACT:
A solder composition for bonding a semiconductor die to a plated or unplated metal package member. In one embodiment the solder composition comprises, in weight percent, 5-8 copper, 20-40 silver, and the balance tin. Such a composition is particularly efficacious for bonding to copper and copper alloy package members. A further embodiment particularly efficacious for bonding to nickel and nickel alloy members further comprises the addition of 0.5-3.0 weight percent selenium.

REFERENCES:
patent: 2124589 (1938-07-01), Palm et al.

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