Solder composition

Details Solder composition Solder composition

1985-07-26

1987-06-02

Rutledge, L. Dewayne

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

C22C 1300

Patent

active

046702172

ABSTRACT:
A low temperature, lead-free, cadmium-free solder for joining metals, primarily copper tube or brass pipe and fittings. The solder composition, being free of lead and other known toxic metals, has a composition range of 0.5-4.0% antimony, 0.5-4.0% zinc, 0.5-2.0% silver and 90.0-98.5% tin, is especially adaptable for plumbing applications where solder joints are exposed to potable water.

REFERENCES:
patent: 1437641 (1922-12-01), Ferriere et al.
patent: 3607253 (1971-09-01), Cain et al.
patent: 4170472 (1979-10-01), Olsen et al.

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