Solder column tip compliancy modification for use in a BGA socke

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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H01R 909

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active

06010340&

ABSTRACT:
A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.

REFERENCES:
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 5033675 (1991-07-01), Shino
patent: 5517752 (1996-05-01), Sakata et al.
patent: 5534667 (1996-07-01), Miyamoto et al.
patent: 5545589 (1996-08-01), Tomura et al.

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