Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1999-09-21
2000-10-03
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
257738, H01R 1200, H05K 100
Patent
active
061264563
ABSTRACT:
A socket connector system for forming a separable electrical contact between a first circuit substrate and a second circuit substrate. A dendrite interposer is disposed between the first circuit substrate and the second circuit substrate. A solder body is disposed between the first circuit substrate and the dendrite interposer. The solder body may include one of several types of solder columns or a solder ball. The solder body has a contact end which engages the dendrite interposer. The contact end has a void. An area of the contact end engages the dendrite interposer when compressive forces are exerted on the first circuit substrate and the second circuit substrate. This provides for all areas of a plurality of contact ends to engage and form reliable electrical contacts with the contact pads.
REFERENCES:
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 5033675 (1991-07-01), Shino
patent: 5475317 (1995-12-01), Smith
patent: 5517752 (1996-05-01), Sakata et al.
patent: 5534667 (1996-07-01), Miyamoto et al.
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5738531 (1998-04-01), Beaman et al.
Campbell Jeffrey S.
Nesky Robert W.
Abrams Neil
Fraley Lawrence R.
Hyeon Hae Moon
International Business Machines - Corporation
LandOfFree
Solder column tip compliancy modification for use in a BGA socke does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder column tip compliancy modification for use in a BGA socke, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder column tip compliancy modification for use in a BGA socke will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-189375