Solder coating processes

Details Solder coating processes Solder coating processes

1988-02-29

1989-12-19

Ramsey, Kenneth J.

Metal fusion bonding

Process

Applying or distributing fused filler

427 96, 118423, 118428, 118429, 118500, 2281802, H05K 334

Patent

active

048877620

ABSTRACT:
Apparatus and method for foam fluxing and tinning the solder pads of a plurality of leadless ceramic chip packages wherein each package is held by suction on a carrier surface such that the pads are exposed to solder as the carrier is passed over a jet of solder. The devices are oriented on the carrier such that the leading edge of the devices is inclined at an angle to the direction of conveying. The conveying system includes an endless chain for passing the carrier in an endless loop through the various stations of loading, fluxing, tinning, cleaning and unloading.

REFERENCES:
patent: 4119211 (1978-10-01), Boyer et al.
patent: 4285457 (1981-08-01), Kondo
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4570569 (1986-02-01), Kondo
patent: 4606788 (1986-08-01), Moran
patent: 4720034 (1988-01-01), Lee
patent: 4766842 (1988-08-01), Long et al.

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