Solder-coating method, and solder paste suitable for use therein

Details Solder-coating method, and solder paste suitable for use therein Solder-coating method, and solder paste suitable for use therein

1994-10-31

1996-09-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, 148 24, B23K 100, H05K 334

Patent

active

055516289

ABSTRACT:
A method of solder-coating a metallic pad provided on a substrate, whereby at least the surface of the pad is provided with a deposit of solder paste, which paste comprises a suspension of metallic solder particles which, when molten, have a surface energy lower than the critical surface energy of the metallic pad but higher than the critical surface energy of the substrate surface outside the borders of the pad, whereby application of heat causes metallic solder particles within the paste lying upon the pad to melt and fuse together into an essentially continuous metallic solder layer, whereas the metallic solder particles within any paste lying upon the substrate surface outside the borders of the pad do not thus fuse together into a layer but are instead deposited as mutually-isolated solder beads, which beads can be subsequently removed from the substrate surface after completion of the heating process.

REFERENCES:
patent: 4607782 (1986-08-01), Mims
W. A. Zisman, "Contact Angle, Wettability, and Adhesion", Advances in Chemistry Series 43, American Chemical Society (1964), LCCC 63-14481, pp. 1-51.
P. G. de Gennes, "Wetting: statics and dynamics", Rev. Mod. Phys. 57, (1985), pp. 827-865.
C. Lea, "A Scientific Guide To Surface Mount Technology", Electrochemical Publications Limited, Scotland, 1988, Chapter 7, pp. 196-233.

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