Solder-coating apparatus

Coating apparatus – With vacuum or fluid pressure chamber

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118 63, 118 74, 118 66, 118 69, 118423, B05C 3132, B05C 1106

Patent

active

043834949

ABSTRACT:
A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member.
An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board. Also, the apparatus includes means to move the contacted circuit board through the bath of molten solder as the displaced solder exerts an upward buoyant force against the circuit board.

REFERENCES:
patent: 1011280 (1911-12-01), Trout et al.
patent: 1898005 (1933-02-01), Drescher
patent: 1979758 (1934-11-01), Merritt
patent: 2176093 (1939-10-01), Merrill
patent: 4072777 (1978-02-01), Schoenthaler
patent: 4101066 (1978-07-01), Corsaro et al.
patent: 4184449 (1980-01-01), Louderback

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solder-coating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder-coating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder-coating apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1562465

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.