Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – To remove or spread applied coating by gas blast
Patent
1986-09-30
1987-11-17
McIntosh, John P.
Coating apparatus
With heat exchange, drying, or non-coating gas or vapor...
To remove or spread applied coating by gas blast
188425, 188503, 269272, 269238, 269254CS, 269 46, B05C 310, B05C 1106, B05C 1302
Patent
active
047066024
ABSTRACT:
A clamp for dipping printed circuit boards into a solder bath of a solder coater machine is disclosed. The clamp comprises first and second interdigitated, coplanar fingers connected respectively at common ends thereof to a pair of spaced, parallel first and second plates. Pivot pins respectively connect adjacent first and second fingers to each other to define a pivot axis extending parallel to and between the distal ends of fingers and the first and second plates. The second plate is spring biased from and movable towards the first plate under an applied actuating force to pivot the second fingers out the plane of the first fingers enabling insertion of a printed circuit board between clamping surfaces defined by the distal ends. The pivot pins and spring mechanism are spaced a sufficient distance from the distal ends to avoid contamination by solder particles and flux during the coating process and to avoid interference with air leveling knives closely spaced to the coated board upon removal from the bath.
REFERENCES:
patent: 3756852 (1973-09-01), Scheetz et al.
patent: 3865298 (1975-02-01), Allen et al.
patent: 4072777 (1978-02-01), Schoenthaler
patent: 4083323 (1978-04-01), Rote
patent: 4534843 (1985-08-01), Johnson et al.
Gyrex Corporation
McIntosh John P.
Plantamura Arthur J.
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