Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1992-03-17
1994-03-22
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174254, 174260, 2281801, 361771, H05K 0100
Patent
active
052966496
ABSTRACT:
A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H<W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W>D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.
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Fukunaga Takao
Fuse Kenichi
Irie Hisao
Kohno Masanao
Kosuga Izumi
Figlin Cheryl R.
Harima Chemicals Inc.
Picard Leo P.
The Furukawa Electric Co. Ltd.
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