Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Reexamination Certificate
2007-02-27
2007-02-27
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
C228S248100
Reexamination Certificate
active
10861371
ABSTRACT:
A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.
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Azuma Takenori
Taniguchi Sanae
Yoshino Hideyuki
Zen Mitsuo
Johnson Jonathan
Senju Metal Industry Co. Ltd.
Tobias Michael
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