Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent
1994-05-02
1995-05-16
Walsh, Donald P.
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
428546, 428548, 428553, 428558, 428559, 361760, B22F 700, H01L 2302
Patent
active
054159440
ABSTRACT:
A solder-clad printed circuit board (100) has solder particles of one alloy (120) arranged within a matrix of a second solder alloy (115). This arrangement forms a flat structure that is alloyed to the solder pads (105) on the substrate. The solder particles (120) have a predetermined melting temperature and are made from one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The second solder alloy (115) is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight, and the second solder alloy may comprise about 12% by weight of the solder cladding.
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patent: 4967950 (1990-11-01), Legg et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5229070 (1993-07-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5320272 (1994-06-01), Melton et al.
Banerji Kingshuk
Bradley, III Edwin L.
Kazem-Goudarzi Vahid
Liebman Henry F.
Dorinski Dale W.
Greaves John N.
Motorola Inc.
Walsh Donald P.
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