Metal fusion bonding – Process – Preplacing solid filler
Patent
1988-06-03
1990-03-06
Godici, Nicholas P.
Metal fusion bonding
Process
Preplacing solid filler
228246, 228254, 228256, 228179, 228 13, 228 17, 29882, H05K 334, B23K 3502, B23K 3706
Patent
active
049068237
ABSTRACT:
The invention relates to a solder carrier comprising a sheet of self-support type, made of a material which does not react to a solder when it is melted, a plurality of small through holes, and solder filling the through holes, each of the small through holes having an end, the area of which is larger than that of the other end. By using this solder carrier, a semiconductor device can be flip-chip-connected to a carrier substrate through a bump method, and solder balls can be formed for connecting the carrier substrate to a multilayer circuit board. The through holes of the solder carrier, each of which holes is to be filled with solder, is formed by etching, and the solder is inserted in the holes under pressure by a roll or the like.
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IBM Technical Disclosure Bulletin, "Cast Solder Preloading . . . ", vol. 20, No. 2, pp. 545, 546, Jul. 1977.
Kushima Tadao
Shirai Mitugu
Soga Tasao
Yamada Kazuji
Godici Nicholas P.
Heinrich Samuel M.
Hitachi , Ltd.
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