Solder bumping of integrated circuit die

Details Solder bumping of integrated circuit die Solder bumping of integrated circuit die

1993-07-15

1994-07-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257779, 257737, 257738, 257746, 257780, 257774, H01L 2348, H01L 2940, H01L 2944, H01L 2952

Patent

active

053270134

ABSTRACT:
A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

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MINICO 6300: Advertisement received from Minico.

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