Solder bump transfer plate

Details Solder bump transfer plate Solder bump transfer plate

1998-12-29

2000-10-24

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

257737, H01L 2348, H01L 2352, H01L 2940, H01L 2100, H01L 2164

Patent

active

061360473

ABSTRACT:
A solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on a semiconductor substrate.

REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 3719981 (1973-03-01), Steitz
patent: 4818728 (1989-04-01), Rai et al.
patent: 4857482 (1989-08-01), Saito et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5135606 (1992-08-01), Kato et al.
patent: 5145552 (1992-09-01), Yoshizawa et al.
patent: 5164336 (1992-11-01), Ohno et al.
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5551148 (1996-09-01), Kazui et al.
patent: 5611481 (1997-03-01), Akamatsu et al.
patent: 5640052 (1997-06-01), Tsukamato
patent: 5996221 (1999-12-01), Chirovsky et al.
"Solder Ball Connection Tensile-Pull Method", IBM TDB, vol. 34, No. 11, pp. 152-153. Apr. 1, 1992.

Affiliated with

Also associated with

Rating

Solder bump transfer plate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder bump transfer plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bump transfer plate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1959352