Solder bump measuring method and apparatus

Details Solder bump measuring method and apparatus Solder bump measuring method and apparatus

1996-12-03

1999-05-25

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

25055923, 356376, B23K 308, G01B 1124

Patent

active

059063092

ABSTRACT:
A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

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patent: 5206705 (1993-04-01), Tokura
patent: 5298977 (1994-03-01), Shintani et al.
patent: 5401979 (1995-03-01), Kooijman et al.
patent: 5521707 (1996-05-01), Castore et al.
patent: 5621814 (1997-04-01), Honda

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