Solder bump forming method, solder bump forming apparatus, head

Details Solder bump forming method, solder bump forming apparatus, head Solder bump forming method, solder bump forming apparatus, head

1997-12-02

2000-04-25

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228103, 2282341, 228246, 427 96, B23K 3512, B23K 3112, B05D 512

Patent

active

060533986

ABSTRACT:
A solder bump forming method includes a step of causing one end surface of a punch inserted into a through hole provided in a die to be retracted by a desired distance from an end surface of the die to thereby provide a recess of a desired volume in the end surface of the die, a step of embedding solder in the recess of the die, a step of moving the punch toward the end surface of the die to thereby extrude the solder, and a step of fusing the solder extruded by the movement of the punch.

REFERENCES:
patent: 5565119 (1996-10-01), Behun et al.
patent: 5653381 (1997-08-01), Azdasht
patent: 5834062 (1998-11-01), Johson et al.
patent: 5878939 (1999-03-01), Luchinger et al.
Patent Abstracts of Japan, vol. 096, No. 006, Jun. 28, 1996, & JP 08 031830 A (Oki Electric Ind. Co., Ltd.), Feb. 2, 1996.

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