Solder bump fabrication method and apparatus

Details Solder bump fabrication method and apparatus Solder bump fabrication method and apparatus

2005-01-18

2005-01-18

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C228S245000

Reexamination Certificate

active

06843407

ABSTRACT:
A solder bump fabrication method is disclosed. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices to prevent the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. The material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short-circuiting.

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patent: 20010000156 (2001-04-01), Cheng
patent: 20020179692 (2002-12-01), Tung et al.
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patent: 1303230 (2001-07-01), None
patent: 1316175 (2001-10-01), None
patent: 437031 (2001-05-01), None

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