Coating processes – Electrical product produced – Metal coating
Patent
1995-12-13
1998-08-18
Beck, Shrive
Coating processes
Electrical product produced
Metal coating
427305, 427328, 427433, 427438, 148 23, 2281801, 228223, 228224, B05D 512
Patent
active
057956197
ABSTRACT:
A process for preparing a solder bump can be prepared by the following procedure. The chip package was cleaned with an alkali or acid solution followed by Zn displacement (zincating)in a displacement solution which comprises NaOH, Z.sub.n o, potassium sodium tartrate and sodium nitrate. After zinc displacement the chip package was performed the electroless Ni--Cu--P deposit in the strong reducing solution which contains NaH.sub.2 PO.sub.2. The chip package deposited with Ni--Cu--P was then dipped into an organic solution as flux which is a mixture of the stearic acid and glutamic acid. Finally, dip soldering of the Ni--Cu--P deposited chip packages in a molten solder bath at a temperature 40.degree..about.80.degree. C. higher than the melting point of the corresponding Pb--Sn alloy.
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Lee Chwan-Ying
Lin Kwang-Lung
Beck Shrive
National Science Council
Talbot Brian K.
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