Dynamic magnetic information storage or retrieval – Record transport with head stationary during transducing – Drum record
Patent
1997-10-14
1999-09-07
Evans, Jefferson
Dynamic magnetic information storage or retrieval
Record transport with head stationary during transducing
Drum record
360104, 21912164, G11B 548, B23K 2600
Patent
active
059496185
ABSTRACT:
A method is disclosed for fabricating an electrical connection between first and second electrical pads. A solder bump is formed on the first electrical pad covering only a portion of the pad, the portion located at a side of the first electrical pad, leaving a vacant portion of the first electrical pad at the opposite side of the first electrical pad from the solder bump. The first and second electrical pads are positioned at an intersecting angle, the second pad extending towards the first electrical pad to intersect the first electrical pad at the vacant portion of the first electrical pad and at a distance less than the height of the solder bump. The solder bump is reflowed, the surface tension thereof causing the solder bump to flow into the vacant portion of the first electrical pad to contact the second electrical pad. The movement of the solder bump towards the vacant end of the first pad allows a connection to be made despite some misalignment between the first pad and the second pad. This movement therefore allows connections to be made between termination pads of an integrated lead suspension and the conductors of a multiconductor flex cable.
REFERENCES:
patent: 4761699 (1988-08-01), Ainslie et al.
patent: 5422764 (1995-06-01), McIlvanie
patent: 5453582 (1995-09-01), Amano et al.
patent: 5486657 (1996-01-01), Bell et al.
patent: 5530604 (1996-06-01), Pattanaik
patent: 5668684 (1997-09-01), Palmer et al.
patent: 5757585 (1998-05-01), Aoyagi et al.
patent: 5821494 (1998-10-01), Albrecht et al.
patent: 5828031 (1998-10-01), Pattanaik
Arya Satya Prakash
Pattanaik Surya
Evans Jefferson
Holcombe John H.
International Business Machines - Corporation
LandOfFree
Solder bump electrical connection and method for fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder bump electrical connection and method for fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bump electrical connection and method for fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1810304