Solder-bump attached optical interconnect structure utilizing ho

Details Solder-bump attached optical interconnect structure utilizing ho Solder-bump attached optical interconnect structure utilizing ho

1990-09-04

1991-10-29

Healy, Brian

Optical waveguides

Integrated optical circuit

25022711, 357 30, 357 32, 357 45, 385 37, 385131, 359 15, 359173, 359900, G02B 612, G02B 532, H01L 2714, H01J 516

Patent

active

050610279

ABSTRACT:
An optical interconnect structure allows the transfer of data within a single integrated circuit as well as the interconnection of multiple integrated circuits. Opto-electronic transmitters and receivers which are fabricated under optimized conditions are coupled to planar optical waveguides. The planar optical waveguides incorporate holographic elements which direct optical emissions from the opto-electronic transmitters into the planar optical waveguide. Other holographic elements incorporated into the planar optical waveguides diffract these optical emissions out of the planar optical waveguide toward the opto-electronic receivers. The entire structure is fabricated and tested separately from the integrated circuits to be interconnected. The interconnect structure is then coupled to the integrated circuits by means of controlled collapse chip connection, or solder bump, technology.

REFERENCES:
patent: 4122479 (1978-10-01), Sugawara et al.
patent: 4169001 (1979-09-01), Kaiser
patent: 4671603 (1987-06-01), McQuoid et al.
patent: 4838630 (1989-06-01), Jannson et al.
patent: 4943556 (1990-07-01), Szu
patent: 4946253 (1990-08-01), Kostuck
patent: 4969712 (1990-11-01), Westwood et al.

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