Solder bonding with improved peel strength

Details Solder bonding with improved peel strength Solder bonding with improved peel strength

1988-02-12

1989-07-25

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428647673, B32B 1504

Patent

active

048513016

ABSTRACT:
A solder bonding technique for bonding discrete circuit elements to conductors on an alumina substrate. The conductors are composed of palladium and silver, and atop each conductor at a bonding site, a layer of silver is provided. A layer of solder is disposed over the layer of silver. The compliancy of the silver layer absorbs stresses created by thermal cycles and thereby improves the peel strength of the solder bond.

REFERENCES:
patent: 3409809 (1968-11-01), Diehl
patent: 3700420 (1972-10-01), Bristow
patent: 4610934 (1986-09-01), Boecker et al.
patent: 4746583 (1988-05-01), Falanga
patent: 4793543 (1988-12-01), Gainey et al.
Research Disclosure, No. 270, Oct. 1986, "A Low Stressed Bonding Structure for Thin Film Adhesion."
Highly Wire Bondable--Low Failure Exposure Top Surface Metallurgy, by Fraser, Jenkins and Lynch, IBM Technical Disclosure Bulletin, vol. 15, No. 10, Mar. 1973, p. 3020.

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