Solder bonding process

Details Solder bonding process Solder bonding process

1982-01-25

1984-03-20

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

228115, 228205, H01R 4302

Patent

active

044372361

ABSTRACT:
Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.

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patent: 3066084 (1962-11-01), Osterman, Jr. et al.
patent: 3444610 (1969-05-01), Thomson
patent: 3451836 (1969-06-01), Spooner et al.
patent: 3630429 (1971-12-01), Matsuda et al.
patent: 3915546 (1975-10-01), Cobaugh et al.
patent: 3919760 (1975-11-01), Roders
patent: 4001464 (1977-01-01), Doutrich et al.
patent: 4167424 (1979-09-01), Jubenville et al.
patent: 4183611 (1980-01-01), Casciotti et al.
Electronic Design 4, Feb. 15, 1980, p. 25, by S. Ohr.
IBM Tech. Disclosure Bulletin, vol. 2, No. 2, Feb. 1960, p. 19.
Precision Metal Molding 21(1), Jan. 1963, p. 61.

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