Metal fusion bonding – Process – Plural joints
Patent
1995-12-28
1999-07-06
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228214, H05K 334, B23K 119
Patent
active
059187948
ABSTRACT:
Each microminiature contact pad included in a dense array of pads on an electronic component contains a relatively thick layer of solder. The layer is treated to form a relatively thin brittle protective layer on the surface of the solder. The structure is then brought into contact with a contact pad in a mating array of pads on another component in a thermo-compression bonding step carried out below the melting point of the solder. In that step, the brittle layer is fractured. As a result, solid-state diffusion of conductive material occurs through fissures in the fractured layer, thereby to provide an electrical connection between mating pads on the two components.
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D'Asaro Lucian Arthur
Goossen Keith Wayne
Hui Sanghee Park
Tseng Betty Jyue
Walker James Albert
Heinrich Samuel M.
Lucent Technologies - Inc.
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