1988-11-21
1991-04-23
Hille, Rolf
357 67, H01L 2348, H01L 2354
Patent
active
050103873
ABSTRACT:
Disclosed is a composition and method for providing conductive electronic component high strength bonding. The composition comprises an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead. The method invention comprises providing a leadframe comprising at least one of power, ground, and signal conductive elements; and preforming solder material onto one of the conductive elements, the solder bonding material having an effective amount of material which is less than 3% by weight of tin and greater than 97% by weight of lead.
REFERENCES:
patent: 274445 (1983-03-01), Dunaway et al.
patent: 4332343 (1982-06-01), Koopman et al.
patent: 4480261 (1984-10-01), Hattori et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4754912 (1988-07-01), Burns
patent: 4814855 (1989-03-01), Hodgson et al.
Solders and Soldering, by Howard Manko, McGraw-Hill Book Company, pp. 38-39.
U.S. Department of Defense Military Standard 883C, Method 1010.5, Titled "Temperature Cycling," Aug. 25, 1983.
Dicks Lori A.
Dunaway Thomas J.
Loy Jerald M.
Spielberger Richard K.
Bruns G. A.
Clark S. V.
Hille Rolf
Honeywell Inc.
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