Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1992-12-16
1994-11-08
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281241, 22818021, 2282481, 29846, H01L 2160
Patent
active
053619668
ABSTRACT:
An improved solder-bonding structure is disclosed that is particularly suitable for soldering the components of hybrid ICs. The solder-bonding structure includes a conductor formed on a substrate. The conductor is formed from silver and platinum. A solder layer formed from a tin and silver solder is then formed on the conductor to couple an electronic element to the conductor. In preferred aspects of the invention, the platinum content in the conductor is in the range of approximately 0.7 to 1.0% by weight. The silver content in the solder layer is in the range of approximately 0.1 to 5.0% by weight.
REFERENCES:
patent: 4081901 (1978-04-01), Miller
patent: 4183136 (1980-01-01), Colla
patent: 4266090 (1981-05-01), Scherer
patent: 4861944 (1989-08-01), Jones, II et al.
Thesis for the 4th Microelectronics Symposium in Tokyo, Japan, "High Reliability of Solder Joint on Hybrid Circuit" by Masakata Kanbe, Hitoshi, Iwata, Katsuya Kogiso, Shouichi Ohya.
"The Role of Thin Film Materials on the Technology of Integrated Circuit Fabrication" Federico Sequeda, Journal of Metals Nov. 1985.
Iwata Hitoshi
Kanbe Masakata
Kinoshita Ken-ichi
Heinrich Samuel M.
Kabushiki Kaisha Tokai Rika Denki Seisakusho
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